Microelectronic package interconnect and method of...

Details Microelectronic package interconnect and method of... Microelectronic package interconnect and method of...

2008-07-22

2008-07-22

Coleman, W. David (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C977S932000

Reexamination Certificate

active

07402909

ABSTRACT:
A method of interconnecting and an interconnect is provided to connect a first component and a second component of an integrated circuit. The interconnect includes a plurality of Carbon Nanotubes (CNTs), which provide a conducting path between the first component and the second component. The interconnect further includes a passivation layer to fill the gaps between adjacent CNTs. A method of producing Anisotropic Conductive Film (ACF) and an ACF is provided. The ACF includes a plurality of CNTs, which provide a conducting path between a first side of the ACF and a second side of the ACF. The sides of the ACF can also include a conductive curable adhesive layer. In an embodiment, the conductive curable adhesive layer can incorporate a B-stage cross-linkable polymer and silver particles.

REFERENCES:
patent: 6383923 (2002-05-01), Brown et al.
patent: 7094679 (2006-08-01), Li et al.
patent: 2003/0089899 (2003-05-01), Lieber et al.
patent: 2004/0246650 (2004-12-01), Grigorov et al.
patent: 2005/0142933 (2005-06-01), Beer et al.
patent: 2005/0191842 (2005-09-01), Aggarwal et al.
patent: 2005/0196950 (2005-09-01), Steinhogl et al.
patent: 2005/0201034 (2005-09-01), Hasegawa
Huang, Z P., et al., “Growth of highly oriented carbon nanotubes by plasma-enhanced hot flament chemical vapor deposition”,Applied Physics Letters, vol. 73, No. 26, (Dec. 28, 1998),3845-3847.
Koratkar, Nikhil A., et al., “Multifunctional structural reinforcement featuring carbon nanotube films”,Composites Science and Technology, (2003), 7 pages.
Vohs, Jason K., et al., “Low-Temperature Growth of Carbon Nanotubes from the Catalytic Decmposition of Carbon Tetrachloride”,J. Am. Chem. Soc., 126, (2004),9936-9937.

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