Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-03-25
2008-03-25
Chang, Rick K (Department: 3726)
Metal working
Method of mechanical manufacture
Electrical device making
C029S825000, C029S830000, C361S277000, C361S278000, C361S280000, C361S281000, C438S689000, C438S694000, C438S697000, C216S011000, C216S033000, C216S036000, C216S080000
Reexamination Certificate
active
07346981
ABSTRACT:
A process for fabricating a MEMS device comprises the steps of depositing and patterning on one side of a wafer a layer of material having a preselected electrical resistivity; bonding a substrate to the one side of the wafer using an adhesive bonding agent, the substrate overlying the patterned layer of material; selectively removing portions of the wafer from the side opposite the one side to define stationary and movable MEMS elements; and selectively removing the adhesive bonding agent to release the movable MEMS element, at least a portion of the layer of material being disposed so as to be attached to the movable MEMS element.
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Borwick, III Robert L.
DeNatale Jeffrey F.
Park Sangtae
Stupar Philip A.
Yao Jun J.
Chang Rick K
Koppel, Patrick, Heybl & Dawson
Teledyne Licensing LLC
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