High-accuracy pattern shape evaluating method and apparatus

Details High-accuracy pattern shape evaluating method and apparatus High-accuracy pattern shape evaluating method and apparatus

2008-07-29

2008-07-29

Nguyen, Sang H. (Department: 2886)

Optics: measuring and testing

Shape or surface configuration

Triangulation

C356S600000, C356S601000, C250S492300, C250S300000, C382S199000

Reexamination Certificate

active

07405835

ABSTRACT:
A quantity (or dispersion value) of a distribution of edge position due to random noise is expected to be reduced statistically to 1/N when N edge position data items are averaged. Using this property, the single page image is averaged in a vertical direction with various values of parameter S, and then the edge roughness index is calculated. The S-dependence of the edge roughness index is analyzed and a term of a dispersion value directly proportional to 1/S is determined as being due to noise.

REFERENCES:
patent: 5585211 (1996-12-01), Firstein et al.
patent: 5805728 (1998-09-01), Munesada et al.
patent: 5896188 (1999-04-01), McCullough
patent: 5969357 (1999-10-01), Todokoro et al.
patent: 6411377 (2002-06-01), Noguchi et al.
patent: 6473162 (2002-10-01), Masaki et al.
patent: 6516528 (2003-02-01), Choo et al.
patent: 6781688 (2004-08-01), Kren et al.
patent: 6839470 (2005-01-01), Ikeda
patent: 6909791 (2005-06-01), Nikitin et al.
patent: 6929892 (2005-08-01), Shishido et al.
patent: 7049589 (2006-05-01), Yamaguchi et al.
patent: 7269287 (2007-09-01), Shishido et al.
patent: 2002/0097913 (2002-07-01), Ikeda
patent: 2003/0021483 (2003-01-01), Yamaguchi et al.
patent: 2005/0275850 (2005-12-01), Bischoff et al.
Yamaguchi, A. et al., Metrology of LER: Influence of Line-Edge Roughness (LER) on Transistor Performance, Proceedings of SPIE Reprint, 2004, pp. 468-476, vol. 5375, (SPIE, Bellingham, WA).
Bunday, Benjamin D., Determination of Optimal Parameters for CD-SEM Measurement of Line Edge Roughness, Proceedings of SPIE Reprint, 2004, vol. 5375 (SPIE, Bellingham, WA).

Affiliated with

Also associated with

Rating

High-accuracy pattern shape evaluating method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-accuracy pattern shape evaluating method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-accuracy pattern shape evaluating method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2805052