Method of making a semiconductor device with improved heat...

Details Method of making a semiconductor device with improved heat... Method of making a semiconductor device with improved heat...

2008-06-03

2008-06-03

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257SE21499

Reexamination Certificate

active

07381592

ABSTRACT:
A method of making a heat dissipation member comprising the steps of forming a resist on a substrate, removing a portion or portions of said resist formed on the substrate in places where posts are to be formed, forming the posts on the substrate in said places where the resist is removed, forming a joint material on the posts disposed on the substrate and removing the remaining resist on the substrate.

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Office Action dated Dec. 19, 2006 issued in corresponding Japanese Application No. 2003-044335.

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