Substrate heat treatment apparatus

Electric heating – Heating devices – Combined with container – enclosure – or support for material...

Reexamination Certificate

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Details

C118S728000, C432S253000, C219S444100

Reexamination Certificate

active

08003919

ABSTRACT:
A heat-treating plate has support elements projecting from an upper surface thereof. The support elements are located at apexes of equilateral triangles arranged regularly and continually. The heat-treating plate and a substrate placed on the support elements form a minute space therebetween which is sealed by a sealer. The substrate is sucked by reducing the pressure in the minute space to a negative pressure through exhaust bores. Since all the distances between adjoining support elements are equal, the substrate sags in the same amount between these support elements. With such arrangement of the support elements, sagging of the substrate is inhibited efficiently by a reduced number of support elements.

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Office Action issued Apr. 15, 2010 in related U.S. Appl. No. 11/566,442 of Shigehiro Goto et al., filed Dec. 4, 2006, which includes, at pp. 4-7, a nonstatutory obviousness-type double patenting rejection over certain claims of the present application.
Japanese Office Action issued Mar. 30, 2010 in connection with Japanese Patent Application No. 2005-351939 (JP10-284360 was previously submitted in an IDS filed Dec. 4, 2006 and is therefore not enclosed.)
Japanese Office Action issued Mar. 30, 2010 in connection with Japanese Patent Application No. 2005-351940.

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