Printed circuit board via with radio frequency absorber

Details Printed circuit board via with radio frequency absorber Printed circuit board via with radio frequency absorber

2008-05-20

2008-05-20

Dinh, Tuan T. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C333S246000, C333S260000, C174S260000, C174S261000, C174S264000, C174S266000, C361S792000, C361S793000, C361S794000, C361S795000, C361S816000, C361S818000

Reexamination Certificate

active

07375290

ABSTRACT:
A printed circuit board with vias that reduce or eliminate radio frequency interference and method of forming the same. The printed circuit board includes non-conductive layers, conductive-layers interspersed between the non-conductive layers, vias extending through the non-conductive layers and the conductive layers, radio frequency absorbing material within each of the vias, where the radio frequency absorbing material is at a conductive layer within the printed circuit board at which a conductive trace is not connected to a via, an insulating layer over each radio frequency absorbing material, and a cylindrical conductive material within via and over each insulating layer.

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