Coplanar silicon-on-insulator (SOI) regions of different...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S152000, C438S155000, C257SE21320, C257SE21545, C257SE21561

Reexamination Certificate

active

07393730

ABSTRACT:
In a first aspect, a first method is provided for semiconductor device manufacturing. The first method includes the steps of (1) providing a substrate; and (2) forming a first silicon-on-insulator (SOI) region having a first crystal orientation, a second SOI region having a second crystal orientation and a third SOI region having a third crystal orientation on the substrate. The first, second and third SOI regions are coplanar. Numerous other aspects are provided.

REFERENCES:
patent: 5296410 (1994-03-01), Yang
patent: 5734564 (1998-03-01), Brkovic
patent: 5882987 (1999-03-01), Srikrishnan
patent: 6815278 (2004-11-01), Ieong et al.
patent: 6830962 (2004-12-01), Guarini et al.
patent: 6972478 (2005-12-01), Waite et al.
patent: 6998684 (2006-02-01), Anderson et al.
patent: 7060585 (2006-06-01), Cohen et al.
patent: 7125785 (2006-10-01), Cohen et al.
patent: 7148092 (2006-12-01), Isobe et al.
patent: 2003/0218171 (2003-11-01), Isobe et al.
patent: 2004/0256700 (2004-12-01), Doris
patent: 2005/0082531 (2005-04-01), Rim
patent: 2005/0277260 (2005-12-01), Cohen et al.
patent: 2006/0024931 (2006-02-01), Chan et al.
patent: 2006/0073646 (2006-04-01), Yang
patent: 2006/0113605 (2006-06-01), Currie
patent: 2006/0170045 (2006-08-01), Yam et al.
patent: 2006/0231893 (2006-10-01), Bernstein et al.
patent: 2006/0272574 (2006-12-01), Waite et al.
patent: 2007/0015346 (2007-01-01), Cohen et al.
Melanie J. Sherony et al., “Minimization of Threshold Voltage Variation in SOI MOSFETs”, Proceedings 1994 IEEE International SOI Conference, Oct. 1994, pp. 131-132.
J. A. Manderlrnan et al., “Floating-Body Concerns for SOI Dynamic Random Access Memory (DRAM)”, Proceedings 1996 IEEE International SOI Conference, Oct. 1996, pp. 136-137.
R. Islam et al., “Wafer Level Packaging and 3D Interconnect for JC Technology”, 2002 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, pp. 212-217.
N. Sato et al., “Precise Thickness Control for Ultra-Thin SOI in ELTRAN® SOI-EpiTHWafer”, 2002 IEEE International SOI Conference, Oct. 2002, pp. 209-210.
A. Vandooren et al., “Scaling Assessment of Fully-Depleted SOI Technology at the 30nm Gate Length Generation”, 2002 IEEE International SOI Conference, Oct. 2002, pp. 25-27.
P. Lindner et al., “3D Interconnect through Aligned Wafer Level Bonding”, 2002 Electronic Components and Technology Conference, pp. 1439-1443.
M. Yang et al., “High Performance CMOS Fabricated on Hybrid Substrate with Differenct Crystal Orientations”, 2003 IEEE, pp. 18.7.1-18.7.4.
M. Yang et al., “On the Integration of CMOS with Hybrid Crystal Orientations”, 2004 Symposium on VLSI Technology Digest of Technical Papers, pp. 160-161.
Akiko Ohata et al., “Mobility Issues in Ultra-Thin SOI MOSFETs: Thickness Variations, GIFBE and Coupling Effects”, 2004 IEEE, pp. 109-112.
Toshinori Numata, “Device Design for Subthreshold Slope and Threshold Voltage Control in Sub- 100-nm Fully Depleted SOI MOSFETs”, IEEE Transactions on Electron Devices, vol. 51, No. 12, Dec. 2004, pp. 2161-2167.
Sixto Ortiz Jr., http://www.processor.com/Editorial/article.asp?article=articles/p2548/31p48.asp&g..., IBM Extends Silicon with SSDOI, published Nov. 28, 2003, vol. 25, Issue 48.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Coplanar silicon-on-insulator (SOI) regions of different... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Coplanar silicon-on-insulator (SOI) regions of different..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Coplanar silicon-on-insulator (SOI) regions of different... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2785356

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.