Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2011-03-22
2011-03-22
Smith, Zandra (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S737000, C257S778000, C257SE21508, C257SE23021, C257SE25013, C438S108000, C438S615000, C438S616000
Reexamination Certificate
active
07911064
ABSTRACT:
A mounted body of the present invention includes: a multilayer semiconductor chip20including a plurality of semiconductor chips10(10a,10b) that are stacked; and a mounting board13on which the multilayer semiconductor chip20is mounted. In this mounted body, each of the semiconductor chips10(10a,10b) in the multilayer semiconductor chip20has a plurality of element electrodes12(12a,12b) on a chip surface21(21a,21b) facing toward the mounting board13. On the mounting board13, electrode terminals14are formed so as to correspond to the plurality of element electrodes (12a,12b), respectively, and the electrode terminals14of the mounting board and the element electrodes (12a,12b) are connected electrically to each other via solder bump formed as a result of assembly of solder particles. With this configuration, a mounted body on which a stacked package is mounted can be manufactured easily.
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Karashima Seiji
Kitae Takashi
Kojima Toshiyuki
Komatsu Shingo
Nakatani Seiichi
Hamre Schumann Mueller & Larson P.C.
Joy Jeremy J
Panasonic Corporation
Smith Zandra
LandOfFree
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