Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2011-04-05
2011-04-05
Sandvik, Benjamin P (Department: 2826)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257SE21502, C257SE23010, C257S692000
Reexamination Certificate
active
07919355
ABSTRACT:
An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
REFERENCES:
patent: 6369454 (2002-04-01), Chung
patent: 6818973 (2004-11-01), Foster
patent: 7572680 (2009-08-01), Hess et al.
Fjelstad Joseph C.
Grundy Kevin P.
Obenhuber Thomas J.
Obenhuber, legal representative Inessa
Segaram Para K.
Myers Bigel Sibley & Sajovec P.A.
Samsung Electronics Co,. Ltd.
Sandvik Benjamin P
Soderholm Krista
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