Semiconductor device package and semiconductor device module

Details Semiconductor device package and semiconductor device module Semiconductor device package and semiconductor device module

1998-07-15

2000-12-19

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257 99, 257433, H01L 2312

Patent

active

061630721

ABSTRACT:
A package storing semiconductor devices and circuit boards with a cap having a plurality of conductive protrusions whose intervals are shorter than or equal to {c/(2v .epsilon..sup.1/2)}, where c is the light velocity, v is the maximum frequency of signals, and .epsilon. is the dielectric constant of the circuit boards. The protrusions attenuate the transmission of electromagnetic waves to reduce noise, cross-talk, parasitic oscillations, etc.

REFERENCES:
Yamaguchi, et al., "New Module Structure Using Flip-Chip Technology for High Speed Optical Communication ICs", IEEE MTT-S Digest, Jun. 1996, pp. 243-246.

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