Fabrication of image sensor with improved signal to noise ratio

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation

Reexamination Certificate

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C257SE27064

Reexamination Certificate

active

07998782

ABSTRACT:
For fabricating an image sensor, an isolation structure is formed to define a first active region of a semiconductor substrate. A first transistor and a second transistor of a unit pixel are formed in the first active region. In addition, a threshold voltage lowering region is formed in a portion of the semiconductor substrate near a portion of the isolation structure abutting the second transistor in the first active region. The threshold voltage lowering region causes the second transistor to have a respective threshold voltage magnitude that is lower than for the first transistor. The threshold voltage lowering region is formed simultaneously with a passivation region in a second active region having a photodiode formed therein.

REFERENCES:
patent: 2006/0105489 (2006-05-01), Rhodes
Korean Patent Publication No. 1020060124888 to Ko, having Publication date of Dec. 6, 2006 (w/ English Abstract page).
Korean Patent Publication No. 1020070049411 to Lee, having Publication date of May 11, 2007 (w/ English Abstract page).
Korean Patent Publication No. 1020070050666 to Huh et al., having Publication date of May 16, 2007 (w/ English Abstract page).

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