Semiconductor integrated circuit device and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction

Reexamination Certificate

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Details

Other Related Categories

C257S758000, C257SE27046, C257S192000

Type

Reexamination Certificate

Status

active

Patent number

08003975

Description

ABSTRACT:
A semiconductor integrated circuit device includes: a semiconductor layer having a principal surface on which a source electrode, a drain electrode and a gate electrode are formed and having a first through hole; an insulating film formed in contact with the semiconductor layer and having a second through hole; a first interconnection formed on the semiconductor layer through the first through hole and connected to one of the source electrode, the drain electrode and the gate electrode which is exposed in the first through hole; and a second interconnection formed on the insulating film through the second through hole and connected to another of the source electrode, the drain electrode and the gate electrode which is exposed in the second through hole. The first interconnection and the second interconnection face each other and form a microstrip line.

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T. Murata et al., IEEE Trans. Electron Devices, 52 (2005) 1042 “Source Resistance Reduction of A1GaN—GaN HFETs with Novel Superlattice Cap Layer”.
M. Higashiwaki et al., Jpn. J.Appl. Phys., 44 (2005) L475, “A1GaN/GaN Heterostructure Field-Effect Transistors with Current Gain Cut-off Frequency of 152 GHz on Sapphire Substrates”.
M. Nishijima et al., 2005 IEEE MTT-S IMS Digest, Session TU4B, “A K-band A1GaN/GaN HFET MMIC Amplifier on Sapphire using novel superlattice cap layer”.

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