Electronic circuit board and its manufacturing method

Details Electronic circuit board and its manufacturing method Electronic circuit board and its manufacturing method

2011-06-28

2011-06-28

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S597000, C438S598000, C438S599000, C438S669000, C438S685000, C438S778000, C438S785000

Reexamination Certificate

active

07968458

ABSTRACT:
A production process for making an electronic circuit substrate comprising: a patterning step of forming a respectively anodically oxidizable conductor pattern and distribution pattern connected to the conductor pattern on a substrate; and an anodic oxidation step of generating an oxide film from the conductor pattern and the distribution pattern by contacting an electrolyte solution with the conductor pattern and the distribution pattern and carrying out anodic oxidation while applying current thereto, the patterns serving as anodes, wherein the width or film thickness of the distribution pattern is at least partially set so that an insulator portion is formed in the anodic oxidation step in which an oxide film formed on one of the side walls of the distribution pattern is integrated with an oxide film formed on the other side wall.

REFERENCES:
patent: 3634203 (1972-01-01), McMahon et al.
patent: 4035206 (1977-07-01), Rioult et al.
patent: 4098637 (1978-07-01), Bell
patent: 4742025 (1988-05-01), Ohyu et al.
patent: 2002/0084456 (2002-07-01), Sugihara et al.
patent: 2005/0013088 (2005-01-01), Horikawa et al.
patent: 61-100971 (1986-05-01), None
patent: 64-086113 (1989-03-01), None
patent: 02-116831 (1990-05-01), None
patent: 04-043328 (1992-02-01), None
patent: 05-343688 (1993-12-01), None
patent: 09-82977 (1997-03-01), None
patent: 2003-255857 (2003-09-01), None

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