Substrate processing apparatus and substrate processing method

Details Substrate processing apparatus and substrate processing method Substrate processing apparatus and substrate processing method

2011-05-17

2011-05-17

Perrin, Joseph L (Department: 1711)

Cleaning and liquid contact with solids

Processes

Including forming a solidified or hardened coating for cleaning

C134S026000, C134S030000, C134S031000, C134S033000, C134S902000

Reexamination Certificate

active

07942976

ABSTRACT:
A rinsing liquid supplier includes a temperature adjuster. The temperature adjuster cools DIW to a temperature lower than room temperature. This temperature adjuster cools down DIW to a temperature not more than 10 degrees centigrade for instance, and cooling down to an even lower temperature of 5 degrees centigrade or below is more preferable. Meanwhile, the temperature adjuster maintains DIW at not less than 0 degrees centigrade, which prevents freezing of the DIW. The cooled DIW supplied to a rinsing liquid pipe is discharged from the rinsing liquid discharge nozzle toward the top surface of the substrate, to thereby form a liquid film. Further, the cooled DIW is discharged toward the rear surface of the substrate from the liquid discharge nozzle via the liquid supply pipe, to thereby form the liquid film on the rear surface. Since the liquid films are already cooled, they are frozen in a short time when the cooling gas is discharged toward the top surface and the rear surface of the substrate.

REFERENCES:
patent: 4817652 (1989-04-01), Liu et al.
patent: 4962776 (1990-10-01), Liu et al.
patent: 5857474 (1999-01-01), Sakai et al.
patent: 6783599 (2004-08-01), Gale et al.
patent: 7604013 (2009-10-01), Nakamura et al.
patent: 2004/0261817 (2004-12-01), Araki et al.
patent: 2006/0048792 (2006-03-01), Nakamura et al.
patent: 2006/0266382 (2006-11-01), Matsubara
patent: 2009/0272407 (2009-11-01), Nakamura et al.
patent: 0 423 761 (1991-04-01), None
patent: 62-169420 (1987-07-01), None
patent: 3-145130 (1991-06-01), None
patent: 3-503975 (1991-09-01), None
patent: 3-261142 (1991-11-01), None
patent: 7-151434 (1995-06-01), None
patent: 07-201795 (1995-08-01), None
patent: 7-240356 (1995-09-01), None
patent: 09-186123 (1997-07-01), None
patent: 11-31673 (1999-02-01), None
patent: 11-274046 (1999-10-01), None
patent: 3343013 (2002-11-01), None
patent: 2006-80315 (2006-03-01), None
Notice of Allowance issued in corresponding Korean Patent Application No. 2007-0102891 mailed Apr. 29, 2009 (Korean language).
Office Action issued Jan. 12, 2010 in related U.S. Appl. No. 11/928,694, which includes, at p. 5, a nonstatutory obviousness-type double patenting rejection over certain claims of the present application.
Office Action issued Aug. 2, 2010 in related U.S. Appl. No. 11/837,575 of Katsuhiko Miya et al., filed Aug. 13, 2007, which includes, at pp. 2-4, a nonstatutory obviousness-type double patenting rejection over certain claims of the present application.
Japanese Office Action received Nov. 24, 2010 in connection with corresponding Japanese Patent Application No. 2006-316541.

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