Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2011-04-05
2011-04-05
Chu, John S (Department: 1722)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S326000, C430S910000
Reexamination Certificate
active
07919227
ABSTRACT:
A positive resist composition including a resin component (A) which exhibits increased alkali solubility under action of acid and an acid-generator component (B) which generates acid upon exposure,the resin component (A) including a structural unit (a1) represented by general formula (I) shown below:wherein R represents a hydrogen atom, a halogen atom, a lower alkyl group or a halogenated lower alkyl group; R1′represents a hydrogen atom or a lower alkyl group; n represents an integer of 0 to 3; R1represents a lower alkyl group, a fluorine atom, or a fluorinated lower alkyl group; and p represents an integer of 0 to 2.
REFERENCES:
patent: 5688628 (1997-11-01), Oie et al.
patent: 5945517 (1999-08-01), Nitta et al.
patent: 6153733 (2000-11-01), Yukawa et al.
patent: 7323287 (2008-01-01), Iwai et al.
patent: 7645559 (2010-01-01), Watanabe et al.
patent: 7781144 (2010-08-01), Kinoshita et al.
patent: 7803512 (2010-09-01), Kinoshita et al.
patent: 2010/0081088 (2010-04-01), Kawaue et al.
patent: H09-208554 (1997-08-01), None
patent: H11-035551 (1999-02-01), None
patent: H11-035552 (1999-02-01), None
patent: H11-035573 (1999-02-01), None
patent: H11-322707 (1999-11-01), None
patent: 2002-220059 (2002-08-01), None
patent: 2003-241385 (2003-08-01), None
patent: 2004-046098 (2004-02-01), None
patent: 2005-043852 (2005-02-01), None
patent: WO 2004-074242 (2004-09-01), None
International Search Report issued for corresponding PCT Application No. PCT/JP2007/065445, dated Sep. 11, 2007.
Iwai Takeshi
Kinoshita Yohei
Ogata Toshiyuki
Chu John S
Knobbe Martens Olson & Bear LLP
Tokyo Ohka Kogyo Co. Ltd.
LandOfFree
Positive resist composition and method of forming resist... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Positive resist composition and method of forming resist..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Positive resist composition and method of forming resist... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2704331