LED-packaging arrangement and light bar employing the same

Details LED-packaging arrangement and light bar employing the same LED-packaging arrangement and light bar employing the same

2011-05-10

2011-05-10

Tran, Minh-Loan T (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S712000, C257S717000, C257S713000, C257S720000, C257SE23051, C257SE23080, C257SE23101, C257S088000, C257S099000

Reexamination Certificate

active

07939919

ABSTRACT:
An LED-packaging arrangement, comprising: a first connection block with an enclosure groove at the bottom thereof; a second connection block with an enclosure groove at the bottom thereof; a light-emitting chip positioned at the top of the first connection block and via connection wires electrically coupled to the first and second connection blocks; a positioning/packaging body, and a transparent packaging body. Alternatively, a third connection block is provided with an enclosure groove at the bottom thereof. In this case, the electrical connection originally to the first connection block via the connection wire is changed to the third connection block. The first and second connection blocks are enclosed by the lower part of the positioning/packaging body in position such that the bottom surfaces of the first and second connection blocks are exposed. The upper part of the positioning/packaging body encloses the light-emitting chip so as to create a reflection cap. The transparent packaging body is employed to seal and fix the light-emitting chip and the connection wires in position for an optimal protection. In this way, the problem of the prior art is resolved that the heat generated by the light-emitting chip is not easily dissipated. Moreover, the heat-dissipating efficiency and the structural strength can be considerably enhanced.

REFERENCES:
patent: 7208772 (2007-04-01), Lee et al.
patent: 2006/0091410 (2006-05-01), Chen
patent: 2007/0126020 (2007-06-01), Lin et al.
patent: 2008/0258162 (2008-10-01), Koung et al.

Affiliated with

Also associated with

Rating

LED-packaging arrangement and light bar employing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with LED-packaging arrangement and light bar employing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and LED-packaging arrangement and light bar employing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2702264