Vertical floating body cell of a semiconductor device and...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S137000, C438S138000, C438S151000, C257S347000, C257S395000

Reexamination Certificate

active

07943444

ABSTRACT:
A semiconductor device includes a tube-type channel formed over a semiconductor substrate. The tube-type channel is connected to first and second conductive lines. A bias electrode is formed in the tube-type channel. The bias electrode is connected to the semiconductor substrate. An insulating film is disposed between the tube-type channel and the bias electrode. A surrounding gate electrode is formed over the tube-type channel.

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patent: 2006-080549 (2006-03-01), None
patent: 100699890 (2007-03-01), None
Shino, Tomoaki, et al., “Floating Body RAM Technology and its Scalability to 32 nm Node and Beyond”, IEEE, (2006).
Hamamoto, Takeshi, et al., “A Floating Body Cell (FBC) fully Compatible with 90 nm CMOS Technology Node for Embedded Applications”, IEEE, (2006).
Okhonin, S., et al., “A SOI Capacitor-less 1T-DRAM Concept”, 2001 IEEE SOI Conference, Oct. 2001; 153-154.

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