Uniform dielectric film deposition on textured surfaces

Details Uniform dielectric film deposition on textured surfaces Uniform dielectric film deposition on textured surfaces

1995-10-24

1998-09-01

Tsai, Jey

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

438691, 438928, 438941, 438964, H01L 2131, H01L 21469

Patent

active

058011048

ABSTRACT:
Uniformity of thin deposited layers on textured surfaces is enhanced by reducing the total surface area available to film deposition. The backside surface area of a semiconductor wafer is reduced prior to film deposition, thereby reducing the available surface to deposition when a deposition process is supply-limited. Reducing the backside surface area suppresses nonuniformities in thin film deposition when the deposition process is substantially supply-limited. The present invention is advantageous for improving uniformity of nitride capacitor dielectric layers deposited on textured electrodes.

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