Dicing tape and die attach adhesive with patterned backing

Details Dicing tape and die attach adhesive with patterned backing Dicing tape and die attach adhesive with patterned backing

2011-08-30

2011-08-30

Smith, Matthew (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257SE21214, C257SE21599, C257SE21505, C438S464000, C438S459000, C156S060000

Reexamination Certificate

active

08008783

ABSTRACT:
Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.

REFERENCES:
patent: 4308331 (1981-12-01), Narita et al.
patent: 4879430 (1989-11-01), Hoffman
patent: 5049085 (1991-09-01), Reylek et al.
patent: 5110388 (1992-05-01), Komiyama et al.
patent: 5118567 (1992-06-01), Komiyama et al.
patent: 5139804 (1992-08-01), Hoffman
patent: 5356949 (1994-10-01), Komiyama et al.
patent: 5525422 (1996-06-01), Spies et al.
patent: 5705016 (1998-01-01), Senoo et al.
patent: 5888606 (1999-03-01), Senoo et al.
patent: 7129150 (2006-10-01), Kawai
patent: 7534498 (2009-05-01), Noda et al.
patent: 2002/0050061 (2002-05-01), Komyoji et al.
patent: 2002/0076848 (2002-06-01), Spooner et al.
patent: 2005/0031795 (2005-02-01), Chaudhury et al.
patent: 2006/0211220 (2006-09-01), Sakaya et al.
patent: 2007/0190318 (2007-08-01), Asai et al.
patent: 2008/0011415 (2008-01-01), Kiuchi et al.
patent: 2010/0035273 (2010-02-01), Axen et al.
patent: 2010/0056725 (2010-03-01), Larson et al.
patent: 08-053655 (1996-02-01), None
patent: 2004-349441 (2004-12-01), None
patent: 2006-104246 (2006-04-01), None
patent: WO 02/06413 (2002-01-01), None
International Search Report for PCT/US2009/035948, pp. 3.

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