Packaged device and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation

Reexamination Certificate

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Details

C438S051000

Reexamination Certificate

active

07906822

ABSTRACT:
A packaged device includes a package having an inner surface defining a closed internal space, a device chip fixed to the package in the internal space, and a parylene film covering at least a part of the inner surface of the package and/or at least a part of a surface of the device chip.

REFERENCES:
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 6614029 (2003-09-01), Asjes
patent: 6640613 (2003-11-01), Rapp et al.
patent: 6956283 (2005-10-01), Peterson
patent: 7199439 (2007-04-01), Farnworth et al.
patent: 2008/0122055 (2008-05-01), Perkins
patent: 2009/0216149 (2009-08-01), Neff et al.
patent: 2003-19700 (2003-01-01), None
patent: 2003-512621 (2003-04-01), None
patent: 2003-172782 (2003-06-01), None
patent: 2003172782 (2003-06-01), None
patent: 2004-341364 (2004-12-01), None
patent: 2005-504419 (2005-02-01), None
patent: 2006-72252 (2006-03-01), None

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