Integrated circuit package system including shield

Details Integrated circuit package system including shield Integrated circuit package system including shield

2011-04-12

2011-04-12

Lee, Eugene (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

C257S678000, C257S708000, C257S730000, C257S732000, C257SE23114, C438S121000, C361S816000

Reexamination Certificate

active

07923822

ABSTRACT:
An integrated circuit package system includes: a substrate; a first device attached to the substrate; a shield attached to the substrate and surrounding the first device; apertures formed within the shield; the shield configured to block electromagnetic energy that passes through the apertures; and an encapsulation material deposited through the apertures.

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patent: 2004/0124518 (2004-07-01), Karnezos
Quirk et al., Semiconductor Manufacturing Technology, Prentice Hall, 2001, pp. 571-574.

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