Methods and apparatus for cleaning semiconductor substrates afte

Details Methods and apparatus for cleaning semiconductor substrates afte Methods and apparatus for cleaning semiconductor substrates afte

1999-01-07

2000-12-19

Gupta, Yogendra

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

438690, 438691, 134 2, 510175, 510176, H01L 21302, C23G 102, C11D 904

Patent

active

061623016

ABSTRACT:
A cleaning solution, method, and apparatus for cleaning semiconductor substrates after chemical mechanical polishing of copper films is described. The present invention includes a cleaning solution which combines deionized water, an organic compound, and a fluoride compound in an acidic pH environment for cleaning the surface of a semiconductor substrate after polishing a copper layer. Such methods of cleaning semiconductor substrates after copper CMP alleviate the problems associated with brush loading and surface and subsurface contamination.

REFERENCES:
patent: 4370173 (1983-01-01), Dollman
patent: 4376673 (1983-03-01), Cheung
patent: 4871422 (1989-10-01), Scardera et al.
patent: 5200024 (1993-04-01), Blonder et al.
patent: 5286300 (1994-02-01), Hnatin et al.
patent: 5354712 (1994-10-01), Ho et al.
patent: 5382296 (1995-01-01), Anttila
patent: 5630904 (1997-05-01), Aoyama et al.
patent: 5662769 (1997-09-01), Schonauer et al.
patent: 5700383 (1997-12-01), Feller et al.
patent: 5705089 (1998-01-01), Sugihara et al.
patent: 5714203 (1998-02-01), Schellenberger et al.
patent: 5794299 (1998-08-01), Gockel et al.
patent: 5806126 (1998-09-01), De Larious et al.
patent: 5810938 (1998-09-01), Murphy
patent: 5824601 (1998-10-01), Dao et al.
patent: 5895563 (1999-04-01), Muranushi
patent: 5897375 (1999-04-01), Watts et al.
patent: 5954997 (1999-09-01), Kaufman et al.
patent: 5965036 (1999-10-01), Maki et al.
patent: 5972862 (1999-10-01), Torii et al.
patent: 5981454 (1999-11-01), Small
Abstract of JP 74039736 B, Oct. 28, 1974, Mitsubishi Heavy Inds., Derwent Accession No. 1974-81814V.
Abstract of JP 53028579 A, Mar. 16, 1978, Koei Chem. Ind. Co. Ltd. and Koei Kagaku Kogyo KK, Derwent Accession No. 1978-31110A.
Abstract of JP 59047400 A, Mar. 17, 1984, Mitsubishi Metal Corp., Derwent Accession No. 1984-104420.

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