Substrate for semiconductor device, resin-sealed...

Details Substrate for semiconductor device, resin-sealed... Substrate for semiconductor device, resin-sealed...

2011-05-24

2011-05-24

Lee, Calvin (Department: 2892)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S750000

Reexamination Certificate

active

07947598

ABSTRACT:
A substrate for a semiconductor device includes: a base plate, a plurality of external terminal portions respectively arranged in a plane on the base plate and having external terminal faces respectively facing the base plate; a plurality of internal terminal portions, respectively arranged in the plane on the base plate and having internal terminal faces respectively facing an opposite side to the base plate. The internal terminal portions are connected with the external terminal portions via wiring portions, respectively. A part of the external terminal portions are located on the base plate in a predetermined arrangement area in which a semiconductor element is arranged.

REFERENCES:
patent: 7825514 (2010-11-01), Ikenaga et al.
patent: 2007/0138619 (2007-06-01), Shinagawa et al.
patent: 2009/0135575 (2009-05-01), Kajiki et al.
patent: A-59-208756 (1984-11-01), None
patent: A-2002-16181 (2002-01-01), None
patent: A-2002-289739 (2002-10-01), None

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