Pattern inspection apparatus and semiconductor inspection...

Image analysis – Applications – Manufacturing or product inspection

Reexamination Certificate

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C382S145000, C382S199000, C430S313000

Reexamination Certificate

active

07978904

ABSTRACT:
There is provided a pattern inspection apparatus that is capable of detecting a defect accurately and efficiently to inspect a pattern of a semiconductor device. The pattern inspection apparatus includes: a contour extraction means for extracting contour data of a pattern from a captured image of the semiconductor device; a non-linear part extraction means for extracting a non-linear part from the contour data; an angular part extraction means for extracting an angular part of a pattern from design data of the semiconductor device; and a defect detection section that compares a position of the non-linear part extracted by the non-linear part extraction section with a position of the angular part extracted by the angular part extraction section so as to detect a position of a defective part of a pattern.

REFERENCES:
patent: 7559047 (2009-07-01), Miyamoto et al.
patent: 2005-277395 (2005-10-01), None

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