Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2011-07-19
2011-07-19
Lee, Eugene (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257S422000, C257S659000, C257S660000, C257S723000, C257S728000, C257SE23114, C438S119000, C438S121000, C438S122000, C438S123000, C438S125000, C438S126000, C438S127000, C174S051000, C174S520000, C174S521000, C029S824000, C029S841000, C029S846000
Reexamination Certificate
active
07981730
ABSTRACT:
An integrated conformal electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a plurality of modules (30-33) to a process carrier (1) using a double side adhesive tape (2), and then sequentially depositing an insulating layer (15) and a conductive shielding layer (16) before encapsulating the modules with a molding compound (17). After removing the adhesive tape (2) to expose a surface of the encapsulated modules, a multi-layer circuit substrate (100) is formed over the exposed surface, where the circuit substrate includes shielding via structures (101-112) that are aligned with and electrically connected to the conductive shielding layer (16), thereby encircling and shielding the circuit module(s).
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Frear Darrel R.
Hayes Scott M.
Mitchell Douglas G.
Tang Jinbang
Cannatti Michael Rocco
Freescale Semiconductor Inc.
Gumedzoe Peniel M
Hamilton & Terrile LLP
Lee Eugene
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