Image sensor package and camera module having same

Television – Camera – system and detail – Solid-state image sensor

Reexamination Certificate

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C250S208100

Reexamination Certificate

active

07929033

ABSTRACT:
An image sensor package includes a first substrate, an image sensor chip, a processing chip and a plurality of passive elements. The first substrate has a supporting surface and a bottom surface opposite to the supporting surface. The image sensor chip is disposed on the supporting surface and electrically connected to the first substrate. The image sensor chip package further includes a second substrate. The processing chip and the passive elements are mounted on the second substrate and electrically connected to the second substrate. The bottom surface of the first substrate defines a cavity for receiving the second substrate, the processing chip and the passive elements therein.

REFERENCES:
patent: 6798053 (2004-09-01), Chiu
patent: 7498606 (2009-03-01), Street et al.
patent: 2004/0189854 (2004-09-01), Tsukamoto et al.
patent: 2004/0198854 (2004-10-01), Takahata et al.
patent: 2004/0251509 (2004-12-01), Choi
patent: 2006/0027740 (2006-02-01), Glenn et al.
patent: 2006/0091487 (2006-05-01), Hanada et al.
patent: 2006/0219862 (2006-10-01), Ho et al.
patent: 2007/0166955 (2007-07-01), Noma
patent: 2007/0292127 (2007-12-01), Kuhmann et al.

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