Methodology and system for determining numerical errors in...

Computer-aided design and analysis of circuits and semiconductor – Design of semiconductor mask or reticle – Analysis and verification

Reexamination Certificate

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C716S050000, C716S052000, C716S053000, C716S054000, C716S055000, C430S005000, C430S030000

Reexamination Certificate

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07975244

ABSTRACT:
A method is provided for designing a mask that includes the use of a pixel-based simulation of a lithographic process model, in which test structures are designed for determining numerical and discretization errors associated with the pixel grid as opposed to other model inaccuracies. The test structure has a plurality of rows of the same sequence of features, but each row is offset from other rows along an x-direction by a multiple of a minimum step size, such as used in modifying masks during optical proximity correction. The images for each row are simulated with a lithographic model that uses the selected pixel-grid size and the differences between row images are compared. If the differences between rows exceed or violate a predetermined criterion, the pixel grid size may be modified to minimize discretization and/or numerical errors due to the choice of pixel grid size.

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Doo-Youl Lee, et al., “Quantitative Evaluation of Grid Size Effect on Critical Dimension Uniformity Improvement”, Japanese Journal of Applied Physics, Part 1, vol. 43, No. 6B, pp. 3680-3683, Date: Jun. 2004.- Abstract.
International Search Report dated Mar. 23, 2009.

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