Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate
2011-05-17
2011-05-17
Clark, S. V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
C257S701000, C438S127000
Reexamination Certificate
active
07944062
ABSTRACT:
A die package (72) for a semiconductor die (20). A plurality of the die packages (72) are formed on a single carrier (10) by applying a body (55) of molding compound across a carrier (10) with an air cavity (70) defined in the molding compound about each of a plurality of device regions (12) of the carrier (10). After a semiconductor die (20) is attached inside the air cavity (70) of each device region (12) and electrically connected with at least one contact pad (14, 16, 18), a cover (68) is applied to close all of the air cavities (70). Following singulation, each semiconductor die (20) is located inside the sealed air cavity (70) of one die package (72). The molding compound of each die package (72) may be locked against movement relative to the device region (12) of the carrier (10) by locking features (30, 38, 48, 50). The locking features (30, 38, 48, 50) may constitute portions of contact pads (14, 16, 18) used to establish electrical communication paths from the semiconductor die (20) to the environment outside of the package (72).
REFERENCES:
patent: 6384472 (2002-05-01), Huang
patent: 6858474 (2005-02-01), Koay et al.
patent: 7109570 (2006-09-01), Manalac et al.
patent: 7176582 (2007-02-01), Kloen et al.
patent: 7247938 (2007-07-01), Groenhuis et al.
patent: 7732937 (2010-06-01), Goller et al.
patent: 2002/0074672 (2002-06-01), Huang
patent: 2003/0102540 (2003-06-01), Lee
patent: 2004/0262781 (2004-12-01), Germain et al.
patent: 2006/0191215 (2006-08-01), Stark
patent: 2006/0197207 (2006-09-01), Chow et al.
patent: 2008/0067698 (2008-03-01), Do et al.
patent: 2008/0157402 (2008-07-01), Ramakrishna et al.
Dijkstra Paul
Groenhuis Roelf Anco Jacob
Clark S. V
NXP B.V.
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