Method of manufacturing a semiconductor device

Details Method of manufacturing a semiconductor device Method of manufacturing a semiconductor device

2011-07-05

2011-07-05

Nguyen, Donghai D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C264S272140, C438S127000

Reexamination Certificate

active

07971351

ABSTRACT:
The objective of the invention is to provide a method of manufacturing a semiconductor device that allows individual molding of plural semiconductor chips carried on a surface of the substrate. It includes the following process steps: a process step in which plural semiconductor elements102are arranged on the surface of substrate100; a process step in which the inner side of substrate102is fixed on lower die130; a process step in which liquid resin114is supplied from nozzle112onto each of the semiconductor elements in order to cover at least a portion of each of semiconductor chips102; a process step in which the upper die having plural cavities144formed in one surface is pressed onto the lower die, and liquid resin114is molded at a prescribed temperature by means of plural cavities144; and a process step in which cavities144of upper die140are detached from the substrate, and plural molding resin portions are formed individually.

REFERENCES:
patent: 5594275 (1997-01-01), Kwon et al.
patent: 5987739 (1999-11-01), Lake
patent: 6344162 (2002-02-01), Miyajima
patent: 6743389 (2004-06-01), Miyajima et al.

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