Resin-sealed type semiconductor devices and manufacturing method

Details Resin-sealed type semiconductor devices and manufacturing method Resin-sealed type semiconductor devices and manufacturing method

1977-03-23

1978-07-11

James, Andrew J.

357 72, 357 74, 357 79, 357 81, 29588, 29589, H01L 2348, H01L 2944, H01L 2952

Patent

active

041005660

ABSTRACT:
When a resin-sealed type semiconductor device having a heat dissipating plate is mounted on a mounting plate by means of screws or the like, means are provided to prevent occurrence of cracks in the resin sealing portion and semiconductor circuit elements embodied therein. To this end, the resin body, heat dissipating plate or mounting plate is thickened at portions thereof where screw receiving apertures are formed. Alternatively, washer or the like member may be employed.

REFERENCES:
patent: 3423516 (1969-01-01), Segerson
patent: 3539875 (1970-11-01), Fong et al.
patent: 3562404 (1971-02-01), Satriano
patent: 3654695 (1972-04-01), Del Gaudio
patent: 3679946 (1972-07-01), Buck et al.
patent: 3729573 (1973-04-01), Dunn
patent: 3754169 (1973-08-01), Lyon et al.

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