Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With means for passing discrete workpiece through plural...
Reexamination Certificate
2011-08-02
2011-08-02
Moore, Karla (Department: 1716)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With means for passing discrete workpiece through plural...
C156S345310, C118S719000, C414S935000
Reexamination Certificate
active
07988812
ABSTRACT:
A substrate treatment apparatus is provided. The substrate treatment apparatus includes a process room, a load port in which a container receiving wafers is disposed, and a wafer transfer module disposed between the load port and the process room to transfer the wafers between the load port and the process room. The wafer transfer module includes a first barrier, a second barrier extending from a first end of the first barrier or from a portion near the first end of the first barrier at a predetermined inclined angle with respect to the first barrier, and a third barrier extending from a second end of the first barrier or from a portion near the second end of the first barrier at a predetermined inclined angle. The load portion is provided along the first barrier. The process room includes a plurality of chambers arranged along the second and third barriers.
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English Translation of JP 04271139 (Hosooka), Apr. 2010.
Choi Kyue-sang
Kim Ki-Sang
Park Soon-Chon
Seo Byong-Kyu
Lee & Morse P.C.
Moore Karla
Samsung Electronics Co,. Ltd.
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