Method of manufacturing wiring board

Details Method of manufacturing wiring board Method of manufacturing wiring board

2011-05-10

2011-05-10

Banks, Derris H (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S843000, C029S739000, C029S825000, C029S846000, C174S254000, C174S260000, C174S261000, C174S262000

Reexamination Certificate

active

07937828

ABSTRACT:
A method of manufacturing a wiring board including an insulating layer where a semiconductor chip is embedded includes: forming, on a supporting board, the insulating layer where the semiconductor chip is embedded and a wiring connected to the semiconductor chip; removing the supporting board by etching; and simultaneously forming first and second reinforcing layers so as to sandwich the insulating layer after removing the supporting board.

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“Carbon Fiber Reinforced Polymer” (Wikipedia, The Free Encyclopedia, Feb. 1, 2009, p. 1&2.

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