FINFET-type semiconductor device and method for fabricating...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S343000, C257S401000, C257SE29112, C257SE29119, C257SE29130, C257SE29136, C438S259000

Reexamination Certificate

active

07986002

ABSTRACT:
A semiconductor device includes: a semiconductor substrate in which a trench is formed; a source region and a drain region each of which is buried in the trench and contains an impurity of the same conductive type; a semiconductor FIN buried in the trench and provided between the source and drain regions; a gate insulating film provided on a side surface of the semiconductor FIN as well as the upper surface of the semiconductor FIN; and a gate electrode formed on the gate insulating film.

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Kedzierski et al., “High-Performance Symmetric-Gate and CMOS-Compatible Vt Asymmetric-Gate FinFET Devices”, International Electron Devices Meeting 2001, IEDM Technical Digest. Washington DC, Dec. 2-5, 2001, New York, NY: IEEE, pp. 1951-1954, XP010575161.
Japanese Notice of Reasons for Rejection, with English translation thereof, issued in Japanese Patent Application No. 2006-507677, mailed on Jan. 18, 2011.

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