Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Finishing or perfecting composition or product
Reexamination Certificate
2011-08-16
2011-08-16
Walke, Amanda C. (Department: 1722)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Finishing or perfecting composition or product
C430S270100, C430S325000, C430S329000, C510S175000, C510S176000
Reexamination Certificate
active
07998664
ABSTRACT:
The present invention provides a resist substrate treating solution and a method for pattern formation using that treating solution, and thereby problems such as foreign substances on the substrate surface, pattern collapse and pattern roughness can be easily solved at the same time. The treating solution comprises water and an alkylene oxide adduct of a primary amine having a hydrocarbon group of 11 to 30 carbon atoms or of ammonia. The method for pattern formation according to the invention comprises a step of treating the developed pattern with that treating solution.
REFERENCES:
patent: 6060209 (2000-05-01), Kondo et al.
patent: 6638899 (2003-10-01), Wakiya et al.
patent: 6825156 (2004-11-01), Lee et al.
patent: 7521405 (2009-04-01), Zhang et al.
patent: 2003/0049570 (2003-03-01), Endo et al.
patent: 2003/0181349 (2003-09-01), Maeno et al.
patent: 2004/0029396 (2004-02-01), Zhang et al.
patent: 2004/0053800 (2004-03-01), Zhang et al.
patent: 2004/0185370 (2004-09-01), Baik et al.
patent: 2004/0204328 (2004-10-01), Zhang et al.
patent: 2005/0101500 (2005-05-01), Baik et al.
patent: 2006/0008925 (2006-01-01), Takashima
patent: 2006/0124586 (2006-06-01), Kobayashi et al.
patent: 2007/0010409 (2007-01-01), Zhang et al.
patent: 2007/0010412 (2007-01-01), Zhang et al.
patent: 8-73893 (1996-03-01), None
patent: 8-225797 (1996-09-01), None
patent: 10-195487 (1998-07-01), None
patent: 11-160878 (1999-06-01), None
patent: 11-295902 (1999-10-01), None
patent: 2002-201492 (2002-07-01), None
patent: 2003-88455 (2003-03-01), None
patent: 2003-107744 (2003-04-01), None
patent: 2004-184648 (2004-07-01), None
patent: 2004184648 (2004-07-01), None
patent: 2004-533010 (2004-10-01), None
patent: 2005-292827 (2005-10-01), None
patent: 2006-16438 (2006-01-01), None
Machine translation of jp 2004-184648 (no date).
English Language Abstract of JP 8-225797 A.
English Language Abstract of JP 8-73893.
English Language Abstract of JP 10-195487 A.
English Language Abstract of JP 11-295902 A.
English Language Abstract of JP 2003-107744 A.
Kobayashi Masakazu
Noya Go
Shimazaki Ryuta
AZ Electronic Materials USA Corp.
Jain Sangya
Walke Amanda C.
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