Leadframe on heat sink (LOHS) semiconductor packages and...

Details Leadframe on heat sink (LOHS) semiconductor packages and... Leadframe on heat sink (LOHS) semiconductor packages and...

2011-04-26

2011-04-26

Tran, Long K (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S666000, C257S686000, C257S706000, C257S777000

Reexamination Certificate

active

07932586

ABSTRACT:
The invention relates to leadframe semiconductor packages mounted on a heat-sink and fabrication thereof. A system in package (SiP) comprises a leadframe having extension leads, configured with divisional heat sinks serving as power and ground nets. A set of semiconductor dies is attached by adhesive on the central region of the lead frame. Pluralities of wire bonds electrically connect the set of semiconductor dies to the leadframe and to the divisional heat sinks respectively. An encapsulation encloses the leadframe, but leaves the extension leads and the divisional heat sink uncovered, exposing a heat dissipating surface.

REFERENCES:
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patent: 6603072 (2003-08-01), Foster et al.
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patent: 2007/0108582 (2007-05-01), Karnezos
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patent: 1819187 (2006-08-01), None
patent: 249829 (2006-02-01), None
English abstract of CN1819187.
“Cost-Effective Chip-on-Heat Sink Leadframe Package for 800-mb/s/Lead Applications” IEEE Transactions on Advanced Packaging, vol. 29, No. 2, pp. 364-371.
“Design and Evaluation of Chip on Heat Sink Quad Flat Package (COHS-QFP) for Consumer Electronics” iMAPS—Taiwan 2005 Technical Symposium, pp. 260-264, Jun. 24-25, 2005.

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