Positive resist composition and patterning process using the...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S326000, C430S330000, C430S311000, C430S905000, C430S907000, C430S914000

Reexamination Certificate

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07923195

ABSTRACT:
The present invention provides a polymer suitable as a base resin for a positive resist composition, especially for a chemically amplified positive resist composition, having a high sensitivity, a high degree of resolution, a good pattern configuration after exposure, and in addition an excellent etching resistance; a positive resist composition using the polymer; and a patterning process.The positive resist composition of the present invention is characterized in that it contains at least, as a base resin, a polymer whose hydrogen atom of a phenolic hydroxide group is substituted by an acid labile group represented by the following general formula (1).

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Matsuzawa et al.; “Theoretical Calculation of Photoabsorption of Various Polymers in an Extreme Ultraviolet Region;”Japanese Journal of Applied Physics; Dec. 1999; pp. 7109-7113; vol. 38 No. 12B.

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