Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2011-03-29
2011-03-29
Nguyen, Cuong Q (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S330000, C257S401000, C257SE23141
Reexamination Certificate
active
07915740
ABSTRACT:
Provided is a semiconductor device that can reduce the resistance in a horizontal direction of a substrate. A current path in a horizontal direction of a substrate is formed in a direction along a short side of the substrate (chip). For example, adopted is a layout in which an element region on an input terminal side and a current extraction region on an output terminal side are aligned along the short side of the chip. Furthermore, a first bump electrode and a second bump electrode, which are respectively connected to the input terminal and the output terminal, are arranged along the short side of the chip. Thus, the current path in the substrate in the horizontal direction in the substrate is formed to have a wide width and a short length. Accordingly, the resistance of the substrate in the horizontal direction is reduced.
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EP Search Report mailed Jul. 17, 2009, directed to European Patent Application No. 07021118.0; 6 pages.
Morrison & Foerster / LLP
Nguyen Cuong Q
Sanyo Electric Co,. Ltd.
Sanyo Semiconductor Co. Ltd.
Tran Trang Q
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