Semiconductor device having improved solder joint and...

Details Semiconductor device having improved solder joint and... Semiconductor device having improved solder joint and...

2011-06-14

2011-06-14

Pham, Thanh V (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S692000, C257S778000, C257SE23001

Reexamination Certificate

active

07960846

ABSTRACT:
A semiconductor chip is mounted on a flexible wiring board through the interposition of an elastomer. The flexible wiring board is made up of a tape on which wiring is fixed. A part of the wiring is projected beyond the edge of the tape, extended in the direction of the thickness of the elastomer and connected to an electrode of the semiconductor chip. The edge of the tape beyond which the wiring is projected protrudes beyond the edge of the elastomer by a length no smaller than the thickness of the elastomer.

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patent: 2002/0168797 (2002-11-01), DiStefano et al.
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Peter Van Zant, Microchip Fabrication, 2000, McGraw-Hill, 4th edition, pp. 400 and 401.
Charles A. Harper, Electronic Packaging and Interconnection Handbook, 2000, McGraw-Hill, pp. 1.7 and 1.8.

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