Substrate earthing mechanism for use in charged-particle...

Details Substrate earthing mechanism for use in charged-particle... Substrate earthing mechanism for use in charged-particle...

2011-04-12

2011-04-12

Harvey, James (Department: 2833)

Electrical connectors

With circuit conductors and safety grounding provision

Grounding to connector container or housing

Reexamination Certificate

active

07922501

ABSTRACT:
A substrate earthing mechanism includes a plate-like spring extending toward a substrate in a direction parallel to a surface of the substrate, and a contact portion coupled to a tip end of the plate-like spring for coming into contact with the substrate to thereby provide electrical conduction therebetween. The plate spring and the contact portion are laid out so that a contact position at which the contact portion is in contact with the substrate and a layout position of the plate-like spring are substantially the same in position as each other in a direction at right angles to the substrate surface in the state that the plate spring is out of its elastic deformation.

REFERENCES:
patent: 5073117 (1991-12-01), Malhi et al.
patent: 5743749 (1998-04-01), Kurakane
patent: 6508664 (2003-01-01), Phalen
patent: 7317322 (2008-01-01), Farnworth et al.
patent: 7608528 (2009-10-01), Tachikawa
patent: 2002/0168883 (2002-11-01), Phalen
patent: 2007/0024864 (2007-02-01), Tachikawa et al.
patent: 2007/0228525 (2007-10-01), Yamanaka et al.
patent: 2005-32963 (2005-02-01), None

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