High density electrical interconnect apparatus and method

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

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439591, 439862, H01R 909

Patent

active

058001840

ABSTRACT:
The present invention relates generally to a new apparatus and method for use in chip, module, card, etc., burn-in and/or test or electrical interconnection. More particularly, the invention encompasses an apparatus that is used as a temporary media between a chip, module, card, etc., that needs to be tested and/or burned-in and a test or burn-in system. A method for such burn-in and/or test or electrical interconnection is also disclosed.
The invention also encompasses an apparatus and a method that can be used as a permanent media between two electrical devices, such as, for example, between a chip and a module or a card, etc., that is to be contained in and part of a system.

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