Semiconductor memory module with reverse mounted chip resistor

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S782000, C361S784000

Reexamination Certificate

active

07990734

ABSTRACT:
A semiconductor memory module having a reverse mounted chip resistor, and a method of fabricating the same are provided. By reverse mounting the chip resistor on the semiconductor memory module, the resistive material is protected, thereby preventing open circuits caused by damage to the resistive material. Also, a chip-resistor connection pad of a module substrate is formed to extend higher from the module substrate than other connection pads connected to other elements. Thus, the resistive material of the chip resistor does not contact the module substrate, thereby preventing poor alignment and defective connections.

REFERENCES:
patent: 7180007 (2007-02-01), Nishikawa et al.
patent: 7468294 (2008-12-01), Yamaura et al.
patent: 05-152101 (1993-06-01), None
patent: 2002-231502 (2002-08-01), None
patent: 2003-282303 (2003-10-01), None
English language abstract of Japanese Publication No. 05-152101.
English language abstract of Japanese Publication No. 2002-231502.
English language abstract of Japanese Publication No. 2003-282303.

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