Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
1998-11-09
2001-11-20
Donovan, Lincoln (Department: 2832)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C174S1170FF, C361S749000
Reexamination Certificate
active
06319019
ABSTRACT:
FIELD OF THE INVENTION
This invention relates to liquid crystal display modules, and more particularly to liquid crystal display modules that include a flexible tape carrier package that connects a liquid crystal display panel to a microelectronic substrate such as a printed circuit board.
BACKGROUND OF THE INVENTION
Liquid Crystal Displays (LCDs) are widely used flat panel displays. As is well known to those having skill in the art, an LCD panel generally includes a thin film transistor substrate, a color filter substrate that is spaced apart from the thin film transistor substrate and a liquid crystal material between the thin film transistor substrate and the color filter substrate.
An LCD module generally includes an LCD panel and a microelectronic substrate such as a Printed Circuit Board (PCB). The PCB may include a timing controller and various other integrated circuit components thereon. The PCB and the LCD panel may be interconnected by a flexible Tape Carrier Package (TCP).
FIG. 1
illustrates a conventional TCP. As shown, the TCP
12
includes a flexible base film including first and second opposing end portions that attach to the LCD panel and to the PCB, respectively. A plurality of conductive leads
20
are also included that extend to the first and second end portions to electrically connect to the LCD panel and to the PCB, respectively. One or more integrated circuits
30
is also included and electrically connected to at least some of the conductive leads
20
.
The conductive leads are formed at both end portions of the flexible base film
10
. The conductive leads
10
may include common signal leads
21
that are at the outermost portion of the flexible base film
10
, dummy leads
23
that are inward from the common signal leads
21
, and input/output leads
27
and
25
that are inward of the dummy leads
23
. Common signals are transmitted to the LCD panel and the PCB through the common signal leads
21
. Signals are not generally provided on dummy leads
23
. Image signals are input to the input leads
27
and output from the output leads
25
.
In order to form an LCD module, an Anisotropic Conductive Film (ACF) is placed on the input pads of the LCD panel. The output leads
25
of the TCP
12
are aligned to the input pads of the LCD panel. The TCP
12
is then heat pressed and attached to the LCD panel using the ACF. Then, output pads on the PCB are aligned to the input leads
27
of the TCP
12
. The TCP
12
is then connected to the PCB by soldering. Alternatively, the TCP
12
may be connected to the PCB using ACF.
During the manufacture of LCD modules, operators and/or equipment may transfer the LCD module by holding the LCD panel. This folds the TCP
12
downwardly due to the weight of the PCB so that the PCB is suspended from the LCD panel by the TCP
12
. Unfortunately, however, when the LCD panel is transferred and/or handled by holding only the LCD panel, the portion of the TCP
12
that is not attached to the LCD panel and the PCB may be twisted due to the movement of the suspended PCB. As a result, the common signal leads and the dummy leads that are formed at the outer portion of the TCP may undergo severe mechanical stress and may even fracture due to fatigue. Moreover, one or more of the input/output leads may crack so that electrical signals that are transmitted therethrough may be degraded.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide improved LCD modules including improved tape carrier packages that connect the LCD panel thereof to the microelectronic substrate thereof.
It is another object of the present invention to provide LCD modules that can reduce the occurrence of fatigue related fractures and/or cracks in the conductive lead of a tape carrier package that connects an LCD panel to a microelectronic substrate.
These and other objects are provided, according to the present invention, by selectively reinforcing the flexible tape carrier package so as to reduce damage in the conductive leads thereof when a microelectronic substrate such as a printed circuit board is suspended from an LCD panel by the tape carrier package. In a preferred embodiment of the invention, the flexible tape carrier package is selectively reinforced by integrating at least two of the conductive leads along at least one selected portion of the tape carrier package between the first and second end portions thereof. Accordingly, by selectively reinforcing the flexible tape carrier package, fracturing and/or cracking of the conductive lines during LCD module manufacture and transport may be reduced.
More specifically, flexible tape carrier packages according to the invention connect an LCD panel to a microelectronic substrate such as a printed circuit board to form an LCD module. The flexible tape carrier package comprises a flexible base film that includes first and second opposing end portions that attach to the LCD panel and to the printed circuit board, respectively, and a plurality of conductive leads that extend to the first and second end portions to electrically connect to the LCD panel and to the printed circuit board, respectively. Flexible tape carrier packages according to the invention also include means for selectively reinforcing the flexible tape carrier package so as to reduce damage in the conductive leads when the printed circuit board is suspended from the LCD panel by the tape carrier package.
The means for selectively reinforcing preferably comprises means for integrating at least two of the conductive leads along at least one selected portion of the tape carrier package between the first and second end portions thereof. It will be understood, however, that other means for selectively reinforcing may be provided. For example, another layer may be added to the flexible base film at the at least one selected portion. Alternatively, reinforcing members may be added within the flexible base film at the at least one selected portion. Other reinforcing structures may also be provided.
In one embodiment of the present invention, the plurality of conductive leads comprises a plurality of common signal leads, a plurality of dummy leads and a plurality of input/output leads. At least two of the common signal leads are integrated along the at least one selected portion of the tape carrier package. Alternatively, at least two of the dummy leads may be integrated along the at least one selected portion. Common signal leads and dummy leads also may be integrated.
The flexible base film preferably includes a window in the first end portion and a folded portion that is spaced apart from the window and that folds when the printed circuit board is suspended from the LCD panel by the tape carrier package. The at least one selected portion is preferably located between the window and the folded portion.
Flexible tape carrier packages according to the invention may be combined with an LCD panel and a microelectronic substrate such as a printed circuit board to provide improved LCD modules. The LCD modules can reduce damage in the conductive leads of the flexible tape carrier package when the printed circuit board is suspended from the LCD panel by the tape carrier package. Improved reliability and/or yield and/or performance may thereby be obtained.
REFERENCES:
patent: 4635359 (1987-01-01), Nozick
patent: 5274195 (1993-12-01), Murphy et al.
patent: 5362547 (1994-11-01), Yamazaki
patent: 5844783 (1998-12-01), Kojima
patent: 5936850 (1999-08-01), Takahashi et al.
patent: 5970608 (1999-10-01), Tighe et al.
patent: 5975944 (1999-11-01), Medina et al.
Kang Won-ho
Kwon Gong-sub
Donovan Lincoln
Lee Kyung S.
Myers Bigel & Sibley & Sajovec
Samsung Electronics Co,. Ltd.
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