Method for aligning a wafer

Details Method for aligning a wafer Method for aligning a wafer

1997-07-11

2000-05-16

Meeks, Timothy

Coating processes

Coating by vapor, gas, or smoke

118715, 438689, 438758, C23C 1600

Patent

active

060634405

ABSTRACT:
A method for aligning a wafer on a support member within a vacuum chamber includes increasing the pressure within the vacuum chamber to at least about 1 Torr before aligning the wafer. The wafer is introduced into the vacuum chamber on the support member, the pressure is increased to at least about one Torr, and the support member is lifted into a shadow ring that has a frustoconical inner cavity constructed to funnel the wafer to a centered, aligned position.

REFERENCES:
patent: 5326725 (1994-07-01), Sherstinsky et al.
patent: 5516367 (1996-05-01), Lei et al.
U.S. application No. 08/564,398, Marohl et al., Nov. 29, 1995.
U.S. application No. 08/939,962, Lei et al., Nov. 29, 1997.

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