Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
1999-05-04
2001-01-09
Booth, Richard (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S612000
Reexamination Certificate
active
06171887
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor device for face down bonding to a mounting substrate and a method for manufacturing the same.
FIG. 9
shows a conventional method for mounting a semiconductor chip directly on a mounting substrate.
First, bump electrodes
2
are provided on an electrode, not shown, provided on a semiconductor wafer or a semiconductor chip
5
. In the case where bump electrodes are to be formed on the semiconductor wafer, the semiconductor wafer is diced into semiconductor chips
5
.
Then the semiconductor chip
5
is face down bounded to the mounting substrate
6
by a flip-chip bonding technique so as to connect the bump electrodes
2
to substrate electrodes
7
on a mounting substrate
6
.
Then, a reflow process is carried out.
Thereafter, in order to improve the heat resistance fatigue, moisture resistance, etc., and ensure the mechanical protection, resin is filled in a clearance between the semiconductor chip
5
and the mounting substrate
6
.
FIG. 10
shows another conventional semiconductor chip mounting method.
First, a semiconductor chip is resin-sealed in a semiconductor package
15
or a semiconductor chip is mounted in a ceramic- or a metal-package
15
.
Thereafter, the semiconductor package
15
is mounted on a mounting substrate
6
.
In the case where the semiconductor chip is to be mounted directly on the substrate, it is necessary to carry out a resin filling step after the semiconductor chip has been mounted on the substrate. For this reason, the assembling cost is increased.
Further, in the case where the semiconductor chip is sealed in the semiconductor package and a resultant package is mounted on the substrate, a so-mounted product becomes bulkier because it uses the package. This decreases the number of semiconductor devices mountable on the mounting substrate and hence lowers the mounting efficiency.
BRIEF SUMMARY OF THE INVENTION
It is accordingly the object of the present invention to provide a semiconductor device which can achieve substantially the same mounting efficiency as that of a bare chip mounting method, while achieving the same extent of reliability as a normal package-sealed semiconductor device, and can lower its full cost.
The object of the present invention is achieved by the following arrangement.
According to one aspect of the present invention there is provided a semiconductor device comprising:
a semiconductor chip; bump electrodes provided on the semiconductor chip; and a protection film coated on a surface of the semiconductor chip, allowing a top surface of the bump electrodes to be exposed, and adapted to, when the semiconductor chip is to be mounted, be molten and bond the semiconductor chip to a mounting substrate and encapsulate a resultant structure.
According to another aspect of the present invention, there is provided a method for manufacturing a semiconductor device, comprising the steps of:
forming bump electrodes on a surface of a semiconductor chip;
coating, on a surface of a semiconductor chip including the bump electrodes, a protection film enough thick to completely cover the bump electrodes, the protection film being allowed to be molten at a time of mounting the semiconductor chip, bond the chip to a mounting substrate and encapsulate the chip; and
polishing the protection film and bump electrodes until the bump electrodes are exposed and their exposed areas become enough great to be bonded.
According to another aspect of the present invention there is provided a package structure comprising:
a mounting substrate;
connection terminals provided on a surface of the mounting substrate;
a soldering or brazing material provided on the connection terminals to allow terminal connection;
a semiconductor chip whose surface is so located as to face the surface of the mounting substrate;
bump electrodes provided on the surface of the semiconductor chip, the bump electrode being connected to the connection terminal by melting the soldering or brazing material for terminal connection; and
a protection film covered on the facing surface of the semiconductor chip in a manner to expose top surfaces of the bump electrodes, the protection film being allowed to be molten, at a time of melting the soldering or brazing material, bond the semiconductor chip to the mounting substrate and encapsulate the chip.
According to another aspect of the present invention there is provided a method for manufacturing a package structure, comprising the steps of:
locating a semiconductor device on a mounting substrate in an aligned relation, the semiconductor device having a semiconductor chip, bump electrodes provided on the semiconductor chip and a protection film covering a surface of the semiconductor chip with top surfaces of the bump electrodes exposed and the mounting substrate having connection terminals on a surface with a soldering or brazing material provided on the connection terminals to allow terminal connection, the locating step being so done as to locate the bump-electrode-carrying surface side of the semiconductor chip opposite to the mounting substrate with the bump electrodes aligned with the soldering or brazing material; and
heating the soldering or brazing material on the terminals of the mounting substrate to a temperature above a melting point to allow the bump electrodes to be connected to the connection terminals, bond the semiconductor chip to the mounting substrate and encapsulate a resultant structure.
Additional objects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objects and advantages of the invention may be realized and obtained by means of the instrumentalities and combinations particularly pointed out in the appended claims.
REFERENCES:
patent: 5600180 (1997-02-01), Kusaka et al.
patent: 5757078 (1998-05-01), Matsuda et al.
patent: 5926694 (1999-06-01), Chigawa et al.
patent: 2-105446 (1990-04-01), None
patent: 2-123757 (1990-05-01), None
patent: 4-260358 (1992-09-01), None
Booth Richard
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Kabushiki Kaisha Toshiba
Luk Olivia
LandOfFree
Semiconductor device for a face down bonding to a mounting... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device for a face down bonding to a mounting..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device for a face down bonding to a mounting... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2503115