Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1997-08-13
2001-05-22
Gandhi, Jayprakash N. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S752000, C361S759000, C361S800000, C361S801000, C206S719000
Reexamination Certificate
active
06236574
ABSTRACT:
CLAIM OF PRIORITY
This application makes reference to, incorporates the same herein, and claims all benefits accruing under 35 U.S.C. §119 from an application for Sub Printed Circuit Board Fixing Device in Electronic Products earlier filed in the Korean Industrial Property Office on Aug. 13, 1997 and there duly assigned Serial No. 33587/1996.
FIELD OF THE INVENTION
The present invention relates to a sub printed circuit board (PCB) attachment device where a sub PCB is mounted on a main PCB in an electronic product such as a computer monitor. Specifically, this invention is a sub PCB attachment device in an electronic product, which couples a sub PCB to a main PCB using a shield and fixing brackets using a connector, thereby fastening the sub PCB more solidly, increasing a shield effect, and facilitating disassembly and assembly of the sub PCB, resulting in improvement of operation efficiency in repairing.
DISCUSSION OF RELATED ART
A general electronic product, such as a monitor, internally contains a main PCB where various circuit elements and parts are soldered, and a sub PCB, as an auxiliary PCB of the main PCB, where various circuit elements and contact connectors are soldered.
The sub PCB must be electrically connected to the main PCB. The sub PCB, where various elements are soldered, has its own weight, thus it must be firmly fastened to keep the electrical connection stable and decrease an inferiority rate in circuits caused by disconnection between the sub and main PCBs.
Since the sub PCB is fixed to the main PCB in a narrow space, it must be installed taking only a small space and facilitating disassembly in case of malfunction in a circuit of a product. Therefore, the sub PCB is vertically positioned on the main PCB so as not to take up too much space. However, when vertically standing the sub PCB, the various circuit elements can be dislocated in case of shock or a drop test for a product, depending on their weight. This prevents good connection in a circuit, causing malfunction in the product.
Since many wires are connected in the narrow space, the sub PCB must be installed to facilitate disassembly and assembly, thus improving operation efficiency in assembly or repair and giving convenience in use. To prevent electrical troubles with other parts when fixed on the main PCB, the sub PCB is surrounded by a shield bracket.
Recently, many circuit elements and parts are attached to the main PCB as an electronic product has a various function. Since the room in main PCB is limited, the sub PCB is demanded to be designed so that it takes the least space when it is connected to the main PCB where many circuit elements and parts have already been attached.
An earlier sub PCB fixing device is fixedly installed at a level with the chassis in an electric product. The sub PCB is vertically positioned on the one side of the main PCB, where many circuit elements are attached, in such a manner that the pin in the lower part of the sub PCB is inserted into the groove formed on the main PCB. The pin and groove are soldered to fix the sub PCB. A shield bracket surrounding the sub PCB is fixed on the main PCB in such a manner that it is inserted into holes formed on the main PCB and soldered, or using a special attachment unit.
Such an earlier sub PCB attachment device has the following problems. First, since the pin in the sub PCB is inserted into the groove in the main PCB and soldered, the efficiency in the connecting operation deteriorates. Since the soldered part must be melted in case of repair or disassembly, the operation efficiency in disassembly deteriorates, and repair is difficult. After a repair, the sub PCB must be soldered again. This is very inconvenient.
Second, the pin in the sub PCB can be dislocated, causing malfunction in a circuit in case of drop test or shock, because there is high possibility of the movement of the sub PCB fixed only by soldering. Moreover, the sub PCB is disconnected, thus damaging other parts or the main PCB, causing malfunction in the whole product.
Third, much space is demanded since a shield bracket must be installed on the main PCB, surrounding the sub PCB. The sub PCB and shield bracket are separated, not integrated, thus the shielding effect deteriorates.
Essentially, malfunction in a circuit occurs very frequently because solid fixation cannot be embodied by the earlier sub PCB fixing device. Soldering connection is the cause of deteriorating operation efficiency and makes repair difficult. The separate shield bracket and sub PCB occupy much space, decreasing available space. Shield effect deteriorates in the separate form, thus electrical malfunction with other parts occurs frequently, thereby deteriorating the quality and the degree of reliability in products.
SUMMARY OF THE INVENTION
An object is to provide a sub PCB fixing device which connects a sub PCB to a main PCB using a connector and uses a shield and support brackets for firm fixation, thereby increasing shield effect and facilitating disassembly and repair.
Another object is to attach a sub PCB to a main PCB and a shield to a sub PCB without the use of soldering.
To achieve these and other advantages, and in accordance with the purpose of the present invention as embodied and broadly described, a connector into which a sub PCB is inserted is installed on a main PCB; a connector pin is formed in the lower part of the sub PCB and inserted into the connector, for an electrical connection; the sub PCB is fastened to a shield bracket for shielding; and a fixing bracket having a catch and a garnering opening is installed on the main PCB.
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Bushnell , Esq. Robert E.
Gandhi Jayprakash N.
Samsung Electronics Co,. Ltd.
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