Multi-lead frame member with means for limiting mold spread

Details Multi-lead frame member with means for limiting mold spread Multi-lead frame member with means for limiting mold spread

1979-10-15

1981-07-21

James, Andrew J.

357 72, 357 80, 357 68, 29588, H01L 2348, H01L 2944, H01L 2960

Patent

active

042801320

ABSTRACT:
Blocking members are provided for limiting mold spread over a desirable area while a semiconductor is molded. The blocking members are composed within a metallic layer together with metallic leads by photoetching techniques. The blocking members are positioned at four corners of an aperture in a predetermined pattern of generally radial fingers extending cantilever-wise inwardly beyond the periphery of the aperture. The semiconductor is adapted to engage bumps on the semiconductor to the metallic leads by wire bonding methods. Extended portions of the metallic leads may also function as the blocking members, with the metallic leads being positioned at the four corners of the aperture.

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patent: 4086696 (1978-05-01), Ikuta
patent: 4107555 (1978-08-01), Haas et al.
patent: 4164811 (1979-08-01), Heywang

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