Photopolymerizable laminating material

Details Photopolymerizable laminating material Photopolymerizable laminating material

1990-08-02

1992-05-19

Brammer, Jack P.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430288, 430271, 522 16, 522 63, 522 75, 522 91, G03C 168

Patent

active

051148315

ABSTRACT:
These photopolymerizable laminating materials consist of at least one film-forming polymer as a binder, at least one organic compound which is compatible with the binder, has at least two double bonds capable of addition polymerization and may be partially replaced by an organic compound having only one double bond capable of addition polymerization, a photoinitiator or photoinitiator system and an adhesion promoter, with or without conventional additives and assistants, the adhesion promoter used being a tricyclic heteroaromatic compound which is soluble in aqueous alkaline solutions.
The said laminating materials are suitable for the production of printed circuits.

REFERENCES:
patent: 3622334 (1971-11-01), Matawan et al.
patent: 3645772 (1972-02-01), Jones
patent: 3751259 (1973-08-01), Bauer et al.
patent: 3887450 (1974-06-01), Gilano et al.
patent: 3953309 (1976-04-01), Gilano et al.
patent: 4234675 (1980-11-01), Kuznetsov
patent: 4268610 (1981-05-01), Roos
patent: 4680249 (1987-07-01), Weed
patent: 4710262 (1987-12-01), Weed
patent: 4741987 (1988-05-01), Tohda et al.
JA-A 61/223 836 Japanese Abstract.
JP-A 62/278 541 Japanese Abstract.
Helv. Chim Acta 79 (1987) 2118-2123.

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