Method for etching tungsten

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156646, 156656, 1566591, B44C 172, C23F 102, C05C 1500, C05C 2506

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active

048635588

ABSTRACT:
Tungsten is rapidly and anisotropically etched under plasma bombardment conditions by using a feed gas mixture which includes a fluorine source (such as SF.sub.6) plus a bromine source (such as HBr), plus a hydrocarbon source (e.g., an alkyl, such as methane).

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