Dual cylindrical target magnetron with multiple anodes

Details Dual cylindrical target magnetron with multiple anodes Dual cylindrical target magnetron with multiple anodes

1996-06-21

1997-07-08

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429814, 20429822, 20429826, C23C 1435

Patent

active

056456999

ABSTRACT:
Two adjacent rotating cylindrical targets are used in a specific form of a vacuum sputtering system to deposit a film of material onto a substrate. Elongated anodes are provided on opposite sides and in between the targets in a manner to make more uniform the rate of deposition across the substrate.

REFERENCES:
patent: 4465575 (1984-08-01), Love et al.
patent: 4466877 (1984-08-01), McKelvey
patent: 4478702 (1984-10-01), Gillery et al.
patent: 4744880 (1988-05-01), Gillery et al.
patent: 4849087 (1989-07-01), Meyer
patent: 5106474 (1992-04-01), Dickey et al.
patent: 5108574 (1992-04-01), Kirs et al.
patent: 5158660 (1992-10-01), Devigne et al.
patent: 5178743 (1993-01-01), Kumar
Patent Abstracts of Japan vol. 018 No. 201 (C-188), 8 Apr. 1994 & JP-A-06-002123 (Mitsubishi Heavy Ind Ltd) 11 Jan. 1994, "abstract".
"Cosputtering and Serial Cosputtering Using Cylindrical Rotatable Magnetrons", A. Belkind, J. Vac. Sci. Technol. A vol. 11(4), Jul./Aug. 1993, pp 1501-1509.
Article of: Sieck, P., "Effect of Anode Location on Deposition Profiles for Long Rotatable Magnetrons," 37th Annual Technical conference of the Society of Vacuum Coaters, Boston, May 8-13, 1994, pp. 233-236.

Affiliated with

Also associated with

Rating

Dual cylindrical target magnetron with multiple anodes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dual cylindrical target magnetron with multiple anodes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dual cylindrical target magnetron with multiple anodes will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2407144