Semiconductor device having temperature regulation means formed

Details Semiconductor device having temperature regulation means formed Semiconductor device having temperature regulation means formed

1994-12-01

1997-07-08

Denion, Thomas E.

Heat exchange

Structural installation

Heating and cooling

219209, 174250, 174252, 174255, 361719, 361720, F25B 2900

Patent

active

056451237

ABSTRACT:
A semiconductor device according to the present invention includes a resistant heating element as a temperature regulation means on a circuit board. A semiconductor chip of the device is connected to the circuit board through connecting electrodes. A difference in temperature between the semiconductor chip and circuit board is kept at a fixed value by controlling the resistant heating element.

REFERENCES:
patent: 3440407 (1969-04-01), Goltsos et al.
patent: 3887785 (1975-06-01), Ahlport
patent: 4374316 (1983-02-01), Inamori et al.
patent: 4739443 (1988-04-01), Singhdeo
patent: 5010233 (1991-04-01), Henschen et al.
patent: 5367434 (1994-11-01), Griffin et al.
IBM Technical disclosure bulletin vol. 23, No. 11 Apr. 1981.
IBM Tehnical disclosure bulletin vol. 24 No. 3 Aug. 1981.

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